Electro-Mechanical

Precision optical, motion-control, and electronic sub-system assemblies built for high-accuracy, high-reliability applications.

PMI provides complex electro-mechanical assembly services that support high-performance equipment used in advanced technology markets. Our capabilities include optical assemblies, precision motion-control systems, and electronically integrated sub-systems built and tested in dedicated departments.

Common Applications

  • Optical inspection systems
  • High-speed, high-accuracy positioning equipment
  • Pattern-recognition and imaging sub-systems
  • Linear-motion control modules
  • Precision integrated sub-systems used in advanced industrial and technology applications

Technical Range

PMI’s electro-mechanical assembly capability includes the following verified processes, integrations, and performance characteristics:

  • Optical assemblies: multi-magnification systems, pattern-recognition sub-systems
  • Optical bonding: lenses, beam-splitters, mirrors; optical-grade adhesives; micro-dot dispensing; UV curing
  • Motion-control sub-systems: linear-motion assemblies; X/Y positioning systems; optical scale encoders
  • Geometric inspection: perpendicularity, parallelism, and co-planarity verified to 0.0001″ accuracy
  • Electronic integration: cable and wire harness assembly (stranded + ribbon)
  • Testing: 100% electrical testing using programmable test equipment
  • Environmental controls: ESD protection; anti-static handling; clean assembly environments

OnSite Equipment

Our electro-mechanical assembly operations are supported by specialized tools, inspection systems, and controlled environments designed specifically for the assemblies we build:

  • “Micro-Dot” adhesive dispensing systems
  • UV curing equipment
  • Optical bonding tools and alignment fixtures
  • Optical scale encoder integration equipment
  • Programmable electrical test systems for 100% harness verification
  • Precision metrology for sub-ten-thousandth alignment checks
  • Clean, antistatic, and ESD-compliant assembly environments